Electronic device

ABSTRACT

Electronic devices are disclosed. The electronic device includes a circuit board. The circuit board contains a first transceiver module pad configured for soldering a first transceiver module thereon; and a second transceiver module pad configured for soldering a second transceiver module thereon. The first transceiver module is different from the second transceiver module, and layouts of the first and second transceiver module pads are the same.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application claims priority of China Patent Application No.201310136794.x filed on Apr. 19, 2013, and China Patent Application No.201310452300.9, filed on Sep. 27, 2013, and the entireties of which areall incorporated by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electronic device, and in particularrelates to an electronic device for multi-frequency transceiver paths.

2. Description of the Related Art

As communication technologies advances, portable electronic devices maynow provide various types of network communications, such as WidebandCode Division Multiple Access (WCDMA), Time Division-Synchronous CodeDivision Multiple Access (TD-SCDMA), and so on. Nevertheless, since eachtype of network communication operates in a different specification, andeach adopts a different form of transmission and reception paths, thusnot only is a considerable area of the printed circuit board required,but also it becomes impossible to implement a circuit design on theprinted circuit board that is compatible to both the transmission andreception paths. For example, given that the printed circuit board ofthe portable electronic device concurrently contains the transmissionand reception paths which serve the frequency band A of the WCDMA andthe frequency band B of the TD-SCDMA, if later the portable electronicdevice is required to be modified to support the frequency band A of theWCDMA and the frequency band B of the WCDMA, the component layout androuting on the printed circuit board is then required to be modifiedaccordingly, and consequently the manufacturing cost and the productionduration of the products are increased considerably.

Therefore, a circuit design which provides compatibility for both thetransmission and reception paths and different network communicationtypes is needed to allow portable electronic devices to have theflexibility to modify network communication types and operationfrequency bands.

BRIEF SUMMARY OF THE INVENTION

A detailed description is given in the following embodiments withreference to the accompanying drawings.

An embodiment of an electronic device is disclosed. The electronicdevice comprises a circuit board. The circuit board comprises a firsttransceiver module pad and a second transceiver. The first transceivermodule is configured for soldering a first transceiver module thereon,and the second transceiver module pad is configured for soldering asecond transceiver module thereon. The first transceiver module isdifferent from the second transceiver module, and layouts of the firstand second transceiver module pads are the same.

Another embodiment of an electronic device is provided. The electronicdevice comprises a baseband processing device, an RF transceiver, afirst transceiver module and a second transceiver module. The basebandprocessing device, configured to perform baseband signal processing. TheRF transceiver, coupled to the baseband processing device, is configuredto convert between a received baseband signal and a RF signal. The firsttransceiver module, coupled to the RF transceiver and an antenna module,is configured to transmit and receive signal of a first type. The secondtransceiver module, coupled to the RF transceiver and an antenna module,is configured to transmit and receive signal of a second type.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a block diagram of an electronic device 100;

FIG. 2A is a schematic diagram of a solder pad 300 for soldering thetransceiver module which transmits the TD-SCDMA signal;

FIG. 2B is a schematic diagram of a solder pad 400 for soldering thereceiver module which receives the TD-SCDMA signal;

FIG. 3 is a block schematic of an electronic device 500 according to anembodiment of the invention;

FIG. 4 is a schematic diagram of a transceiver module solder pad 600according to an embodiment of the invention;

FIG. 5 is a schematic diagram of a transceiver module solder pad 700according to another embodiment of the invention;

FIG. 6 is a schematic diagram of a transceiver module solder pad 800according to yet another embodiment of the invention;

FIG. 7 is a schematic diagram of a transceiver module solder pad 900according to still another embodiment of the invention;

FIG. 8 is a schematic diagram of a transceiver module solder pad 1000according to yet still another embodiment of the invention;

FIG. 9 is a schematic diagram of a transceiver module solder pad 1100according to yet still another embodiment of the invention; and

FIG. 10 is a schematic diagram of a circuit board 1200 of the electronicdevice according to an embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

The following description is of the best-contemplated mode of carryingout the invention. This description is made for the purpose ofillustrating the general principles of the invention and should not betaken in a limiting sense. The scope of the invention is best determinedby reference to the appended claims. Further, the term “coupling”includes any direct or indirect electrical connection. Thus if a firstdevice is coupled to a second device, it represents the fact that thefirst device may electrically connect to the second device directly, ormay electrically connect to the second device via other devices orindirect means.

FIG. 1 is a block diagram of an electronic device 100. The electronicdevice 100 may be a notebook computer, a mobile phone, a portable gamedevice, tablet computer, and the like. The electronic device 100 mayinclude a circuit board 110 and a plurality of devices soldered thereon.In one implementation, the devices soldered on the circuit board 110include a baseband processing device 200, an RF transceiver 202, atransceiver module 204, a receiver module 206, a transmitter module 208,and an antenna module 210. The baseband processing device 200 mayinclude a plurality of hardware devices to perform baseband signalprocessing, such as digital-to-analog conversion/analog-to-digitalconversion, gain adjustment, modulation/demodulation, coding/decoding,and the like. The RF transceiver 202 receives an RF signal, converts theRF signal into a baseband signal to output to the baseband processingdevice 200, or it receives a baseband signal from the basebandprocessing device 200, and converts the received baseband signal to theRF signal. The receiver module 206 is a WCDMA transceiver module,coupled between the RF transceiver 202 and the antenna module 210,configured to receive a WCDMA signal from the antenna module 210, ortransmit the WCDMA signal to the antenna module 210. The receiver module206 and the transmitter module 208 are coupled between the antennamodule 210 and the RF transceiver 202, configured to transmit andreceive a TD-SCDMA signal, respectively. In one embodiment, the basebandprocessing device, the RF transceiver, the transceiver module, thereceiver module, the transmitter module, and the antenna module aredisposed on separate hardware devices (such as a standalone integratedcircuit) or passive components by being soldered onto the circuit board110, and coupled to adjacent devices via one or more transmission lines.The circuit board 110 may include a plurality of component solder pads,wherein each component solder pad is configured for soldering acorresponding device thereon. For example, a baseband processing devicepad is configured for soldering the baseband processing device 200, anRF transceiver pad is configured for soldering the RF transceiver 202,and an antenna pad is configured for soldering the antenna module 210.

As shown in FIG. 1, for WCDMA applications, the transmission path andthe reception path occupy different frequency bands, and therefore, theembodiment utilizes a multiplexer to implement the WCDMA transceivermodule. As for TD-WCDMA applications, the transmission path and thereception path occupy the same frequency band. Since it is difficult torecognize signals of transmission path or receiver path in the samefrequency band, using one component for transmitting and receiving theTD-SCDMA signals becomes problematic. As a consequence, two separate anddedicated modules (such as two filter modules) are required to implementthe transmission path and the reception path for the TD-SCDMA.Accordingly, two separate and dedicated pads will be needed on thecircuit board 110 for soldering the transceiver module 204 and thereceiver module 206 for the TD-SCDMA signal.

FIG. 2A is a schematic diagram of a solder pad 300 for soldering thetransmitter module which transmits the TD-SCDMA signal. FIG. 2B is aschematic diagram of a solder pad 400 for soldering the receiver modulewhich receives the TD-SCDMA signal. As illustrated in FIG. 2A, thesolder pad 300 for soldering the transmitter module 208 includes aninput pad, an output pad and three ground pads. As for FIG. 2B, thesolder pad 400 for soldering the receiver module 206 includes an inputpad, two output pads and two ground pads. Therefore, in total there are10 solder pads adopted by the TD-SCDMA transmission path and receptionpath. As a consequence, the package adopting separate and dedicatedsolder pads for transmitter and receiver modules not only requires morespace, but also increases the pin count. Meanwhile, because the solderpad layouts for transmitting and receiving signals are different, thisadds complication to the manufacturing processes. For example, when aclient requests to replace the TD-SCDMA transceiver module with theWCDMA transceiver module, the manufacturer can only change the solderpads correspondingly.

Therefore, an electronic device 500 as in FIG. 3 is disclosed accordingto an embodiment of the invention. FIG. 3 is a block schematic of anelectronic device 500 according to an embodiment of the invention. Theelectronic device 500 may be a notebook computer, a handset, a portablegame device, a tablet computer, and the like. The electronic device mayinclude circuit board 510 and a plurality of devices soldered on thecircuit board 510. Based on one embodiment of the invention, the devicessoldered on the circuit board include a baseband processing device 200,an RF transceiver 202, a first transceiver module 504, a secondtransceiver module 506 and an antenna module 210. The electronic devices500 and 100 are distinct in that the electronic device 500 adopts onemodule, or the second transceiver module 506, in place of the receivermodule 206 and the transmitter module 208 in FIG. 1.

For simplicity, in one embodiment of the invention, the firsttransceiver module is a WCDMA transceiver module, the second transceivermodule is a TD-SCDMA transceiver module. It should be noted that FIG. 3only illustrates a simplified block diagram which depicts the principleof the invention, in which only components relevant to the invention areshown. For example, in some embodiments, the electronic device 500 mayfurther include a processing unit (such as a microprocessor) whichcontrols the processes in the entire system. Consequently, theembodiments of the invention are not limited to the content shown inFIG. 3. Moreover, apart from using the second transceiver module 506 inplace of the receiver module 206 and the transmitter module 208 in FIG.1, the first transceiver module 504 and the second transceiver module506 can use the same footprint for the package. Note that the embodimentreplacing the transmission path and the reception path of processing theTD-SCDMA signal with the second transceiver module soldered on onesingle solder pad. Since the replaced second transceiver module canadopt the same footprint as that of the first transceiver module,consequently, even a client requests to change to another networkcommunication type of signal for data transmission and reception, themanufacturer can still adopt the original solder pads, therebysimplifying the manufacturing processes and decreasing manufacturingcosts. The solder pads for soldering the second transceiver module(TD-SCDMA transceiver module) will be used to illustrate the embodimentof the invention.

FIG. 4 is a schematic diagram of a transceiver module solder pad 600according to an embodiment of the invention. The solder pad 600 includes9 pads within a square frame, arranged in three rows and three columns.Specifically, the three pads in the first column are respectively thefirst transmission pad, the second transmission pad and the first groundpad; the three pads in the second column are respectively the secondground pad, the third ground pad and the antenna pad; the three pads inthe third column are respectively the reception pad, the fourth groundpad and the fifth ground pad. Among all pads, the reception pad is usedto receive the input signal IN, the first and second transmission padsare used to transmit the differential output signal OUT+ and OUT−, theantenna pad is used to multiplex the transmission signal and thereception signal to perform communication with the antenna, and the fiveground pads are used to connect to the ground. In order to accomplishthe objectives of alternately transmitting and receiving in the samefrequency band at different time durations which TD-SCDMA requires, whenoperating in the transmission state of TD-SCDMA, the signal loss betweenthe reception pad and the antenna pad is configured to be less than thatbetween the first and second transmission pads. In other words, a lowsignal loss is present between the reception pad and the antenna pad, ahigh signal loss is present between the reception pad and thetransmission pad. Meanwhile, the signal loss between the antenna pad andthe reception pad remains at an all-time high when operating in thetransmission state of TD-SCDMA. When operating in the reception state ofTD-SCDMA, the signal loss between the antenna pad and the transmissionpad is configured to be less than that between the antenna pad and thereception pad. That is to say, a low signal loss is present between theantenna pad and the transmission pad, a high signal loss is presentbetween the antenna pad and the reception pad, while the signal lossbetween the transmission pad and the antenna always remains high whenoperating in the reception state of TD-SCDMA. As a result, the pad 600not only decreases the pin count, but also significantly reduces thearea of the printed circuit board in comparison to adopting thededicated and separate solder pads for the transmitter module andreceiver module. Moreover, since the solder pad 600 can be used forsoldering the first transceiver module as well as the second transceivermodule, the signal network communication type and frequency bandallocation of the electronic device has increased flexibility. It isworth noting that, although the solder pad illustrated in the embodimentcontains 9 pads, the number of pads is not limited to 9 and 9 is chosenfor illustration purposes. The principle of the invention is met so longas two transceiver modules adopt the same solder pad footprint.

FIG. 5 is a schematic diagram of a transceiver module solder pad 700according to another embodiment of the invention. The solder pad 700includes 8 pads within a square frame, separately arranged in threecolumns. The first column includes three pads separately arranged, thesecond column includes two pads separately arranged, and the thirdcolumn includes three pads separately arranged. In particularly, thethree pads in the first column are in order of the first transmissionpad, the second transmission pad and the first ground pad; the two padsin the second column are in order of the second ground pad and theantenna pad; the three pads in the third column are in order of thereception pad, the third ground pad and the fourth ground pad. In orderto accomplish the objectives of alternately transmitting and receivingin the same frequency band at different time durations which TD-SCDMAtechnology adopts, when operating in the transmission state of TD-SCDMA,the signal loss between the reception pad and the antenna pad isconfigured to be less than that between the two transmission pads. Inother words, a low signal loss is present between the reception pad andthe antenna pad, and a high signal loss is present between the receptionpad and the transmission pads. Meanwhile, the signal loss between theantenna pad and the reception pad always remains high when operating inthe transmission state of TD-SCDMA. When operating in the receptionstate of TD-SCDMA, the signal loss between the antenna pad and thetransmission pads is configured to be less than that between the antennapad and the reception pad. That is to say, a low signal loss is presentbetween the antenna pad and the transmission pads, and a high signalloss is present between the antenna pad and the reception pad, while thesignal loss between the transmission pads and the antenna pad alwaysremains high when operating in the reception state of TD-SCDMA. As aresult, the solder pad 700 can be used for soldering the firsttransceiver module as well as the second transceiver module. Incomparison to the solder pad 600 in FIG. 4, the pad 700 furtherdecreases the pin count.

FIG. 6 is a schematic diagram of a transceiver module solder pad 800according to yet another embodiment of the invention. The solder pad 800includes 7 pads, namely first and second transmission pads, a receptionpad, an antenna pad, and first, second and third ground pads. As aconsequence, the solder pad 800 can be used for soldering the firsttransceiver module as well as the second transceiver module. Incomparison to the solder pad 600 in FIG. 4 and the solder pad 700 inFIG. 5, the pad 800 further reduces the pin count.

FIG. 7 is a schematic diagram of a transceiver module solder pad 900according to still another embodiment of the invention. Please alsorefer FIG. 1 and FIG. 3, the configuration of the transceiver module 900can be applied to the transceiver module 204 in FIG. 1, the firsttransceiver module 504 and the second transceiver module 506 in FIG. 3.Please refer next to FIG. 5 and FIG. 7, when the solder pad footprintcorresponding to the 8 pads is adopted, the first transceiver module 504includes 8 pins which contain first and second transmission pins, areception pin, an antenna pin and first through fourth ground pins. Inorder to reduce out-of-band noises, provide high-efficiency energyconversion, and increase transmission quality of the TD-SCDMA RF signal,the embodiment of the invention places three interdigital transducers(IDT) on the transceiver module 900, coupled to the first and secondtransmission pins, the reception pin and the antenna pin respectively,and provides two paths implemented by a polished surface of a substratematerial with piezoelectric characteristics. As depicted in FIG. 7, oneof the two paths is formed by the polished surface of the substratematerial with the piezoelectric characteristics between the IDT coupledto the reception pin and the IDT coupled to the antenna pin, and theother one of the two paths is formed by the polished surface of thesubstrate material with the piezoelectric characteristics between theIDT coupled to the antenna pin and the IDT coupled to the transmissionpin.

Those skilled in the art will recognize that, although 8 pins areadopted in the embodiment, other numbers of pad counts such as thetransceiver module solder pad with 7 pads or 9 pads and other numbers ofpin counts such as the transceiver module with 7 pins or 9 pins, whichobey the principle of the invention, are within the scope of theinvention.

Since the TD-SCDMA module in the embodiment adopts one transceivermodule for transmitting and receiving the signal, the two separatesmodules are no longer required. Consequently the number of pads may bereduced, as well as reducing the required area of the printed circuitboard. Further, different signal types of the WCDMA signal and theTD-SCDMA signal can use the same solder pad footprint for packaging,providing increased flexibility to clients for modifying the transceivermodule to operate in different signal types and frequency bands.

FIG. 8 is a schematic diagram of a transceiver module solder pad 1000according to yet still another embodiment of the invention. Asillustrated in FIG. 8, the solder pad 1000 contains 8 pads within thesquare frame, arranged in three columns. The first column includes threepads separately arranged, the second column includes two pads separatelyarranged, and the third column includes three pads separately arranged.Specifically, the three pads in the first column are in order of thefirst transmission pad, the second transmission pad and the first groundpad; the two pads in the second column are in order of the second groundpad and the antenna pad; the three pads in the third column are in orderof the reception pad, the third ground pad and the second antenna pad.The reception pad is used to receive the input signal IN, the first andsecond transmission pads are used to transmit the differential outputsignal OUT+ and OUT−, the first antenna pad is used to transmit signalsto communicate with the antenna, the second antenna pad is used toreceive signals to communicate with the antenna, and the four groundpads are used to connect to the ground. In order to accomplish theobjectives of alternately transmitting and receiving in the samefrequency band at different time durations which TD-SCDMA technologyadopts, when operating in the transmission state of TD-SCDMA, the signalloss between the reception pad and the antenna pads is configured to beless than that between the reception pad and the two transmission pads.In other words, a low signal loss is present between the reception padand the antenna pad, and a high signal loss is present between thereception pad and the transmission pads. Meanwhile, the signal lossbetween the antenna pad and the reception pad always remains high whenoperating in the transmission state of TD-SCDMA. When operating in thereception state of TD-SCDMA, the signal loss between the antenna pad andthe transmission pads is configured to be less than that between theantenna pad and the reception pad. That is to say, a low signal loss ispresent between the antenna pad and the transmission pads, and a highsignal loss is present between the antenna pad and the reception pad,while the signal loss between the transmission pads and the antenna padalways remains high when operating in the reception state of TD-SCDMA.As a result, in comparison to the dedicated and separate solder padswhich the transmitter and receiver modules are soldered thereon, thesolder pad 1000 not only decreases the pin count but also significantlyreduces the area of the printed circuit board.

FIG. 9 is a schematic diagram of a transceiver module solder pad 1100according to yet still another embodiment of the invention. As depictedin FIG. 9, the configuration of the transceiver module 1100 may beapplied to the transceiver module 204 in FIG. 1, and the firsttransceiver module 504 and the second transceiver module 506 in FIG. 3.When adopting the solder pad footprint in FIG. 8, corresponding to 8pads, the first transceiver module 504 includes 8 pins which containfirst and second transmission pins, a reception pin, first and secondantenna pins and first through third ground pins. In order to reduceout-of-band noises, provide high-efficiency energy conversion, andincrease transmission quality of the TD-SCDMA RF signal, the embodimentof the invention places four IDTs on the transceiver module 1100,respectively coupled to the first and second transmission pins, thereception pin and the first and second antenna pins. The embodiment ofthe invention also provides two paths implemented by a polished surfaceof a substrate material with piezoelectric characteristics. As depictedin FIG. 9, one of the two paths is formed by the polished surface of thesubstrate material with the piezoelectric characteristics between theIDT coupled to the reception pin and the IDT coupled to the firstantenna pin, and the other one of the two paths is formed by thepolished surface of the substrate material with the piezoelectriccharacteristics between the IDT coupled to the second antenna pin andthe IDT coupled to the transmission pins.

FIG. 10 is a schematic diagram of a circuit board 1200 of the electronicdevice according to an embodiment of the invention. As shown in FIG. 10,the circuit board 1200 includes a transceiver module solder pad 1210, aselection switch pad 1220 and an antenna solder pad 1230. Taking thetransceiver module solder pad 1210 which includes 8 pads as an example,the 8 pads of the transceiver module solder pad 1210 may be laid out asthe solder pad footprint 700 in FIG. 5 or the solder pad footprint 1000in FIG. 8. People skilled in the art will recognize that, both of thesolder pad footprint 700 in FIG. 5 and the solder pad footprint 1000 inFIG. 8 contain 8 pads, the primary difference lies in that the fourthground pad in the solder pad footprint 700 corresponds to the secondantenna pad in the solder pad footprint 1000. In the present embodiment,said pad is regarded as the A pad in the solder pad f1210. In order tomake the solder pad footprint 700 and solder pad footprint 1000compatible on the circuit board 1200, the selection switch pad 1220 isconfigured on the circuit board 1200. On the circuit board 1200, one endof the selection switch pad 1220 is connected to the A pad, the othertwo ends of the selection switch pad 1220 are respectively connected tothe antenna solder pad 1230 and the ground. Thus, the selection switchpad 1220 connects the A pad to the ground, or it connects the A pad withthe antenna solder pad 1240 by controlling a selection switch.Particularly when the solder pad footprint 700 is chosen to be adoptedfor the transceiver module solder pad 1210, the A pad (which correspondsto the fourth ground pad of the solder pad footprint 700) of thetransceiver module solder pad 1210 is connected to the ground bycontrolling the selection switch pad 1220. When the solder pad footprint1000 is chosen to be adopted for the transceiver module solder pad 1210,the A pad (which corresponds to the second antenna pad of the solder padfootprint 1000) of the transceiver module solder pad 1210 is connectedto the antenna solder pad 1230 by controlling the selection switch pad1220.

Those skilled in the art will recognize that the embodiments in FIGS. 8through 10 adopt the transceiver module solder pads including 8 pads and8 pins to illustrate the principle of the invention. Transceiver moduleswith other numbers of solder pads, such as 7 pads or 9 pads, and othernumbers of pins, such as 7 pins or 9 pins, are within the scope of theinvention.

Through the approaches disclosed in the embodiments, when the WCDMAsignals and TD-SCDMA signals of different signal network communicationtypes are applied to the packages with the same pad number but differentsolder pad footprints, the layout and routing on the printed circuitboard is not required to be changed to allow the replacement for thetransceiver module operated with different signal types and differentfrequency bands.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. An electronic device, comprising: a circuitboard, comprising: a first transceiver module pad, configured forsoldering a first transceiver module thereon; and a second transceivermodule pad, configured for soldering a second transceiver modulethereon; wherein the first transceiver module is different from thesecond transceiver module, and layouts of the first and secondtransceiver module pads are the same.
 2. The electronic device of claim1, wherein: the first transceiver module is configured to transmit andreceive data in a first communication type; and the second transceivermodule is configured to transmit and receive data in a secondcommunication type.
 3. The electronic device of claim 1, wherein: thefirst transceiver module is configured to transmit and receive a signalin a first frequency band; and the second transceiver module isconfigured to transmit and receive a signal in a second frequency band.4. The electronic device of claim 1, wherein, the first transceivermodule further comprises: a transmission pin, comprising a firsttransmission pin and a second transmission pin; a reception pin; and atleast two ground pins; the first transceiver module pad furthercomprises: a first transmission pad and a second transmission pad,electrically connected to the first transmitter pin and the secondtransmitter pin respectively, configured to transmit differential outputsignals; a reception pad, electrically connected to the reception pin,configured to receive an input signal; an antenna pad, electricallyconnected to the antenna pin, configured to multiplex to a transmissionsignal and a reception signal to provide communication through anantenna module; and at least two ground pads, electrically connected tothe ground pins for grounding.
 5. The electronic device of claim 4,wherein: signal loss between the reception pad and the antenna pad isless than those between the first and second transmission pads; andsignal loss from the antenna pad to first and second transmission padsare less than that between the antenna pad and the reception pad.
 6. Theelectronic device of claim 1, wherein: the first transceiver modulecomprises 8 pads within a square frame, arranged in three columns,wherein the first column includes three pads disposed separately, thesecond column includes two pads disposed separately, and the thirdcolumn includes three pads disposed separately.
 7. The electronic deviceof claim 6, wherein: the three pads in the first column are a firsttransmission pad, a second transmission pad and a first ground pad; thetwo pads in the second column are a second ground pad and an antennapad; the three pads in the third column are the reception pad, a thirdground pad and a fourth ground pad.
 8. The electronic device of claim 1,wherein: the first transceiver module comprises 9 pads within a squareframe, arranged in three rows and three columns and disposed separately.9. The electronic device of claim 8, wherein: the three pads in thefirst column are a first transmission pad, a second transmission pad anda first ground pad, respectively; the three pads in the second columnare a second ground pad, a third ground pad and the antenna pad,respectively; the three pads in the third column are the reception pad,a fourth ground pad and a fifth ground pad, respectively.
 10. Theelectronic device of claim 4, wherein: the antenna pin further comprisesa first antenna pin and a second antenna pin; the antenna pad furthercomprises a first antenna pad and a second antenna pad electricallyconnected to the first antenna pin and the second antenna pinrespectively; the first antenna pad is configured to communicate withthe antenna module by the transmission signal; and the second antennapad is configured to communicate with the antenna module by thereception signal.
 11. The electronic device of claim 1, wherein thecircuit board further comprising: a selection switch pad, configured forsoldering a selection switch thereon; wherein the selection switch iscompatible with different transceiver modules with same number of solderpads.